| 摘要 |
PROBLEM TO BE SOLVED: To provide a buildup multilayer wiring board in which the thickness of copper on a buildup surface layer is thin and on which a fine circuit can be formed. SOLUTION: In the buildup multilayer wiring board, an interlayer via is bored by a laser, an umbrella-shaped protrusion of a conductor layer formed in a via opening is left, a conductive paste is filled into the via, and a plated layer does not exist on the conductor layer. The method of manufacturing the buildup multilayer wiring board comprises a process in which the interlayer via is formed by the laser and in which the umbrella-shaped protrusion of the conductor layer is formed in the via opening and a process in which the conductive paste is filled into the via. COPYRIGHT: (C)2003,JPO |
