METHOD OF MANUFACTURING MULTILAYER PRINTED-WIRING CIRCUIT BOARD AND MULTILAYER PRINTED-WIRING CIRCUIT BOARD USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a high-accuracy and high-density multilayer printed board which can deal with the small diameter of a conductor connecting hole. SOLUTION: A conventional contact dry film which causes a cumulative dislocation between itself and a printed wiring board is not used, and an etching mask is plotted and worked directly by a laser beam 60 on a resin coat 70 coming into contact with the printed wiring board 10. COPYRIGHT: (C)2003,JPO