| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique by which a multilayer printed-wiring board comprising an interstitial via-hole structure is manufactured effectively, in a high yield and with satisfactory efficiency. SOLUTION: The multilayer printed-wiring board 1 of a IVH structure is manufactured in such a way that conductor circuits (3a, 3b, 3c and 3d) are formed on faces on one side of insulating rigid boards (2a, 2b, 2c and 2d) composed of a single-sided copper-clad laminate, that adhesive layers (4a, 4b, 4c and 4d) are formed on their faces on the other side, that holes coming into contact with the conductor circuits by passing the two layers are formed in the boards and the adhesive layers and that single-sided circuit boards (7a, 7b, 7c and 7d) comprising via holes (6a, 6b and 6d) formed by filling a conductive paste 5 into the holes are laminated. In the method which is provided, the multilayer printed-wiring board 1 is manufactured in a high yield and with satisfactory efficiency. COPYRIGHT: (C)2003,JPO |
