| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a via-hole conductor for a multilayer ceramic electronic part in which a process can be shortened largely, an electrical connection between an internal electrode and the via-hole conductor is improved, and the minute via-hole conductor can be formed, and to provide a capacitor using the method. SOLUTION: In the manufacturing method for the electronic part 10, laser beams having a wavelength of 400 nm or less is penetrated in the laminating direction by irradiating a dielectric block 1, in which ceramic green sheets 20 containing a binder resin are laminated while the internal electrodes 3 and 4 are arranged among the ceramic green sheets 20, with the laser beams while through-holes 15 and 16 having different bore diameters on one sides and bore diameters on the other sides are formed, and the through-holes 15 and 16 are filled with conductive paste. COPYRIGHT: (C)2003,JPO
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