SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE, AND ENVIRONMENT-CONSTRUCTING METHOD FOR INFORMATION PROCESSING

摘要

PROBLEM TO BE SOLVED: To provide an electronic device that can efficiently package a semiconductor package.

SOLUTION: A substrate 1 is provided for packaging a plurality of first semiconductor packages P0 to P8 where a processor apparatus is mounted, and a plurality of second semiconductor packages M0 to M8 where a memory apparatus is mounted. On the substrate 1, a mounting region where the packages are mounted and a non-mounting region are formed alternately in the vertical and horizontal directions, thus making nearly uniform wiring distance among packages, and nearly uniformizing the timing of data access to the memory apparatus from the processor apparatus.

COPYRIGHT: (C)2003,JPO