发明名称 APPARATUS AND METHOD FOR PROCESSING SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To inhibit swell in a liquid film of a coating liquid at the outer- periphery section of a wafer. <P>SOLUTION: At an upper end section 54b of a cup 54, a plurality of impellers 56 projecting to the side of an opening Q are provided. Each impeller 56 is aligned in the circumference direction of the opening Q. Then, when a wafer W is to be rotated and the film thickness of a coating liquid on the wafer W is to be adjusted, an opening rate at the opening Q is reduced by the impeller 56, thus reducing an air current flowing into the cup 54, and reducing the speed of the air current near the outer-periphery section of the wafer W. As a result, the drying speed of the coating liquid at the outer-periphery section of the wafer W becomes slow, and the deposition of the dried coating liquid to the outer-periphery section of the wafer W is inhibited. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003179041(A) 申请公布日期 2003.06.27
申请号 JP20010376055 申请日期 2001.12.10
申请人 TOKYO ELECTRON LTD 发明人 TANAKA TAKASHI;NAGASHIMA SHINJI;NAKAJIMA MASAHIKO
分类号 G03F7/16;B05C11/08;H01L21/027;H01L21/31 主分类号 G03F7/16
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