POLISHING SOLUTION, POLISHING METHOD, AND POLISHING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a polishing solution, polishing method and polishing apparatus, which can efficiently and inexpensively polish an excessive copper film deposited on a surface of a substrate, while preventing deterioration of the quality of a product.

SOLUTION: The polishing solution is used to polish a surface of a substrate on which a copper film is formed and the copper is embedded into fine recesses thereon. The solution contains one or more of water-soluble inorganic acid or salts thereof, water-soluble organic acid or salts thereof, and one or more of hydroxyquinolines.

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