| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a bonding unit which is capable of uniformly applying a load and conducting ultrasonic vibrations to any semiconductor chip without exception, when the semiconductor chip is mounted on a circuit board through ultrasonic bonding. <P>SOLUTION: Protruding electrodes 17 are brought into contact with a circuit wiring 32, and ultrasonic vibrations are conducted to the contacting areas of the electrodes 17 with the circuit wiring 32, to melt the contacting areas so as to bond a semiconductor chip 10 to a circuit board 31 through this bonding unit; the bonding unit is equipped with a bonding head 36 which presses a semiconductor chip 10 against a circuit board 31 as it applies a load, a piezoelectric element 41 which generates ultrasonic vibrations, a vibration conducting mechanism 42 which conducts the ultrasonic vibrations to the bonding head 36, and a low-elasticity film 62 interposed in between the bonding head 36 and the semiconductor chip 10; and the low-elasticity film 62 is fed between the bonding head 36 and the semiconductor chip 10 from a film feed roll 61a and recovered by a film recovery roll 61b for each bonding process. <P>COPYRIGHT: (C)2003,JPO</p> |
