| 摘要 |
PROBLEM TO BE SOLVED: To increase the reliability, to reduce a manufacturing cost, and to increase the productivity of an electronic component. SOLUTION: While a pressing load is controlled by a control section 13, with solder bumps 4 being heated by a heat table 6, a distance detection member 11 detects the maximum elevated position of a mounting nozzle 5 where the mounting nozzle 5 is most separated from the turn table 6. When the mounting nozzle 5 is drawn near to the turn table 6 by a bump depressing distance from the maximum elevated position, the control section 13 stops the movement of the mounting nozzle 5. COPYRIGHT: (C)2003,JPO
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