| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that a defect possibly occurs in a buried thin film capacitor when an MCM is produced using a build-up process and such a defect may cause short-circuiting to the earth thus disabling the MCM. SOLUTION: The chip module element 10 comprises an array 16 of capacitors 16a-16g, a planar interconnection structure 58 coupled with the capacitor array, and a multilayer circuit structure 54 coupled with the planar interconnection structure comprising a plurality of conductive elements 37a and 37b for conducting the capacitor and the multilayer circuit structure electrically, and a plurality of conductive pins 60 coupled with the multilayer circuit structure. The capacitor array is arranged to be charged by feeding a current from the pin through the multilayer circuit structure and the conductive element to the capacitor. COPYRIGHT: (C)2003,JPO
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