发明名称 |
INSULATING FILM-FORMING METHOD, AND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To achieve a reliable high-k film having superb insulating characteristics. SOLUTION: After a metal hafnium layer 12 is formed on a silicon substrate 10, the surface of the silicon substrate 10 and the metal hafnium layer 12 are oxidized, thus forming a silicon oxide film 14 containing Hf set to be a high-k film on the surface of the silicon substrate 10. COPYRIGHT: (C)2003,JPO
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申请公布号 |
JP2003179049(A) |
申请公布日期 |
2003.06.27 |
申请号 |
JP20010377201 |
申请日期 |
2001.12.11 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
NIWA MASAAKI |
分类号 |
H01L27/04;H01L21/28;H01L21/316;H01L21/822;H01L29/51;H01L29/78;(IPC1-7):H01L21/316 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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