发明名称 INSULATING FILM-FORMING METHOD, AND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To achieve a reliable high-k film having superb insulating characteristics. SOLUTION: After a metal hafnium layer 12 is formed on a silicon substrate 10, the surface of the silicon substrate 10 and the metal hafnium layer 12 are oxidized, thus forming a silicon oxide film 14 containing Hf set to be a high-k film on the surface of the silicon substrate 10. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003179049(A) 申请公布日期 2003.06.27
申请号 JP20010377201 申请日期 2001.12.11
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NIWA MASAAKI
分类号 H01L27/04;H01L21/28;H01L21/316;H01L21/822;H01L29/51;H01L29/78;(IPC1-7):H01L21/316 主分类号 H01L27/04
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