| 摘要 |
PROBLEM TO BE SOLVED: To reduce variations in polishing when polishing a projection formed on a semiconductor substrate by a CMP method. SOLUTION: The manufacturing method of a semiconductor device is a process in case where a projection 5 formed on a semiconductor substrate 1 is polished by the CMP method for performing planarization processing. The process is set to be the preprocess of the CMP process. In the process, the projection 5 is subjected to chemical dry etching treatment with a photoresist film 6 having an opening 7 on the projection 5 as a mask, and the periphery section including the projection 5 is subjected to planarization in advance. COPYRIGHT: (C)2003,JPO
|
