发明名称 |
ELECTRONIC COMPONENT ASSEMBLING METHOD AND ELECTRONIC COMPONENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide an assembling method for an electronic component which is easy in assembling, high in quality, and low in cost and the electronic component which is assembled by the assembling method. <P>SOLUTION: While a light emitting element 113 is inserted into a through hole 124 for shading and the light emitting element and an Si substrate 114 are arranged opposite each other, the Si substrate is mounted on a solid substrate 120. The number of components is therefore smaller than before and the assembly is facilitated to lower the cost. The method is not a method of stacking and assembling components one by one like before, so that high mounting precision can be obtained and high-quality and low-cost manufacturing becomes possible. <P>COPYRIGHT: (C)2003,JPO |
申请公布号 |
JP2003179268(A) |
申请公布日期 |
2003.06.27 |
申请号 |
JP20010380055 |
申请日期 |
2001.12.13 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
AZUMA KAZUJI;TOMITA KAZUYUKI |
分类号 |
H01L23/29;H01L23/12;H01L23/31;H01L23/32;H01L25/065;H01L25/07;H01L25/18;H01L31/02;H01L31/12;H01L33/62;H05K1/02;H05K1/14;H05K1/18 |
主分类号 |
H01L23/29 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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