| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition for image formation having improved anti-tackiness of a preliminarily dried film, capable of improving electrical properties by a lowered dielectric constant and suitable for a solder resist, an etching resist and an electroless plating resist for production of a printed wiring board, an insulating layer of a build-up process printed wiring board, a black matrix, a color filter, photo-spacers, electrodes, barrier ribs and a phosphor for production of a liquid crystal display panel, a printing plate, etc. <P>SOLUTION: The photosensitive resin composition comprises a curable resin having two or more radical-polymerizable unsaturated bonds and one or more hydroxyl groups and/or carboxyl groups per molecule, a compound having two or more vinyl ether groups and/or vinyl thio-ether groups per molecule and a photopolymerization initiator. <P>COPYRIGHT: (C)2003,JPO |
