发明名称 WAFER INSPECTION DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To constitute a substrate inspection device that has driving shafts in two orthogonal axial directions and inspects a substrate by moving the substrate and the observational visual field of an optical system provided for observing the substrate relatively to each other, to make it small in size. <P>SOLUTION: A drive device 1 is provided with X- and Y-shaft drive mechanism 10 and 20, which move a table 41 in orthogonal X and Y directions and a controller 5 which controls the operations of the drive mechanism 10 and 20. The controller 5 positions the chip region of a wafer W in the visual observation field of the optical system 50 for optical measurement by moving the table 41 through the control of the operations of the drive mechanism 10 and 20. The wafer W is held on the table 41, in a state with the wafer W inclined by a prescribed angle, with respect to the X and Y-shafts. The controller 5 positions the wafer W in the visual observation field of the optical system 50, by moving the table 41 by means of operating the drive mechanisms 10 and 20 within a drive range, in which the moving ranges of the shafts are smaller than the diameter of the wafer W. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003179122(A) 申请公布日期 2003.06.27
申请号 JP20010376723 申请日期 2001.12.11
申请人 NIKON CORP 发明人 YAMADA TOMOAKI;ISHII HIROKAZU
分类号 G01R31/02;H01L21/027;H01L21/66;H01L21/68;(IPC1-7):H01L21/68 主分类号 G01R31/02
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