| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multi-layer printed wiring board with less warps even for the multi-layer printed wiring board for which a remaining copper rate is different on the front and back surfaces while the surface of the low remaining copper rate warps in a concave shape in the case that the remaining copper rate is different on the front and back surfaces in the multi-layer printed wiring board. SOLUTION: In the manufacturing method for the multi-layer printed wiring board, at the time of forming a resin layer to be a resist layer on the front and back surfaces of the multi-layer printed wiring board, the thickness of the resist layer on the surface of the high remaining copper rate is formed to be double or more of the thickness of the resist layer on the surface of the low remaining copper rate. COPYRIGHT: (C)2003,JPO |
