| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic part being capable of being miniaturized and lightened and having high mechanical strength, heat resistance and high-frequency characteristics. SOLUTION: The electronic part 1 has a resin layer 10 constituted while using a resin as a main component and a conductor layer 23 brought into contact with the resin layer and formed of a conductor. The resin layer has metal- containing resin layers 10a to 10f comprising a resin obtained by reacting a metallic alcoxide or the partial condensate of the metallic alcoxide and a synthetic resin. COPYRIGHT: (C)2003,JPO
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