发明名称 THERMAL TREATMENT DEVICE FOR SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a thermal treatment device which is capable of heating a substrate in a concentric manner or a gradient manner, in which the distribution of temperature in the substrate is concentric or gradient in a certain direction as it is optionally changing the temperature of the substrate. SOLUTION: This thermal treatment device thermally treating an angular substrate is composed of a lower hot plate equipped with a temperature control means, a spacing body which is low in thermal conductivity and arranged along the periphery of the lower hot plate, four or more side hot plates which are thermally isolated from each other, and four or more temperature control means which heat up the above side hot plates. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003178960(A) 申请公布日期 2003.06.27
申请号 JP20010402658 申请日期 2001.12.12
申请人 SIGMA MELTEC LTD 发明人 TAKANO MICHIROU;KATADA OSAMU
分类号 H05B3/00;H01L21/027;(IPC1-7):H01L21/027 主分类号 H05B3/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利