| 摘要 |
PROBLEM TO BE SOLVED: To provide a high productivity semiconductor laser having a reference plane of sufficient strength and heat dissipation properties. SOLUTION: A base frame 21, a laser element mounting frame 22 and a lead frame 23 are formed by punching and bending a sheet of metal plate. The reference plane is defined by the reference plane parts 21a and 21b of the base frame 21 and stuck with heat dissipating/reinforcing metal plates 24 and 24 thus producing a frame type laser exhibiting high strength and heat dissipation properties. A laser element 26 is mounted on the laser element mounting frame 22 and the circumference thereof is molded of resin 29 except the light exit side. Since the laser element 26 and the wire 27 require no protective caps, batch production can be carried out. In other words, batch mass production can be carried out by forming a frame by punching a sheet of metal plate and molding the laser element with resin without using any cap. COPYRIGHT: (C)2003,JPO
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