| 摘要 |
PURPOSE: A semiconductor side braze is provided to actively cope with variable chip sizes by making two paddles of different sizes on which a chip is mounted so that an electrical test is performed twice. CONSTITUTION: A ceramic main body(20) is prepared. The first and second paddles(21,22) are formed on the ceramic main body. The first and second inner terminals(23,24) are so formed to have a step along the edge of the first and second paddles. The first and second inner layers are formed inside the ceramic main body. The first and second outer terminals(27,28) are brazed to a side of the ceramic main body. The first inner circuit pattern connects the first inner terminal with the first outer terminal. The second inner circuit pattern connects the second inner terminal with the second outer terminal.
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