发明名称 |
Planarization of ceramic substrates using porous materials |
摘要 |
This invention provides a concept of using porous materials on ceramic substrate planarization. This planarized substrate comprises a ceramic substrate, a buffer layer, and a nanostructure layer. The ceramic substrate can enhance the structural strength and surface-mount capability. The buffer layer provides the adhesion between a substrate and a nanostructure layer. Nanostructure layer provides the required surface smoothness of the ceramic substrates for performing thin-film processing techniques and enhancing adhesion for metallization and electronic materials. This layer also provides required properties for integrating electronic such as thermal conductivity, electrical insulation, dielectric, etc.
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申请公布号 |
US2003118738(A1) |
申请公布日期 |
2003.06.26 |
申请号 |
US20010023878 |
申请日期 |
2001.12.21 |
申请人 |
SHUY GEOFFREY WEN-TAI;LU JONG-HONG;LIAO SHENG-JU;CHANG HUAI-LUH;HONG SONG-WEIN;HUANG RUEY-CHENG |
发明人 |
SHUY GEOFFREY WEN-TAI;LU JONG-HONG;LIAO SHENG-JU;CHANG HUAI-LUH;HONG SONG-WEIN;HUANG RUEY-CHENG |
分类号 |
C04B41/52;C04B41/89;H01L21/48;H05K1/03;H05K3/38;(IPC1-7):B05D5/12;B05D1/36 |
主分类号 |
C04B41/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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