发明名称 Chamber hardware design for titanium nitride atomic layer deposition
摘要 A lid assembly and a method for ALD is provided. In one aspect, the lid assembly includes a lid plate having an upper and lower surface, a manifold block disposed on the upper surface having one or more cooling channels formed therein, and one or more valves disposed on the manifold block. The lid assembly also includes a distribution plate disposed on the lower surface having a plurality of apertures and one or more openings formed there-through, and at least two isolated flow paths formed within the lid plate, manifold block, and distribution plate. A first flow path of the at least two isolated flow paths is in fluid communication with the one or more openings and a second flow path of the at least two isolated flow paths is in fluid communication with the plurality of apertures.
申请公布号 US2003116087(A1) 申请公布日期 2003.06.26
申请号 US20010032293 申请日期 2001.12.21
申请人 NGUYEN ANH N.;CHIAO STEVE H.;YUAN XIAOXIONG;LEI LAWRENCE CHUNG-LAI;XI MING;YANG MICHAEL X.;SEUTTER SEAN M.;ITOH TOSHIO 发明人 NGUYEN ANH N.;CHIAO STEVE H.;YUAN XIAOXIONG;LEI LAWRENCE CHUNG-LAI;XI MING;YANG MICHAEL X.;SEUTTER SEAN M.;ITOH TOSHIO
分类号 C23C16/34;C23C16/44;C23C16/455;(IPC1-7):C23F1/00;C23C16/00;H01L21/306 主分类号 C23C16/34
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