发明名称 |
Chamber hardware design for titanium nitride atomic layer deposition |
摘要 |
A lid assembly and a method for ALD is provided. In one aspect, the lid assembly includes a lid plate having an upper and lower surface, a manifold block disposed on the upper surface having one or more cooling channels formed therein, and one or more valves disposed on the manifold block. The lid assembly also includes a distribution plate disposed on the lower surface having a plurality of apertures and one or more openings formed there-through, and at least two isolated flow paths formed within the lid plate, manifold block, and distribution plate. A first flow path of the at least two isolated flow paths is in fluid communication with the one or more openings and a second flow path of the at least two isolated flow paths is in fluid communication with the plurality of apertures.
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申请公布号 |
US2003116087(A1) |
申请公布日期 |
2003.06.26 |
申请号 |
US20010032293 |
申请日期 |
2001.12.21 |
申请人 |
NGUYEN ANH N.;CHIAO STEVE H.;YUAN XIAOXIONG;LEI LAWRENCE CHUNG-LAI;XI MING;YANG MICHAEL X.;SEUTTER SEAN M.;ITOH TOSHIO |
发明人 |
NGUYEN ANH N.;CHIAO STEVE H.;YUAN XIAOXIONG;LEI LAWRENCE CHUNG-LAI;XI MING;YANG MICHAEL X.;SEUTTER SEAN M.;ITOH TOSHIO |
分类号 |
C23C16/34;C23C16/44;C23C16/455;(IPC1-7):C23F1/00;C23C16/00;H01L21/306 |
主分类号 |
C23C16/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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