| 摘要 |
An adhesive attachment assembly is provided for mounting an attachment member such as a threaded stud or the like onto a substrate, wherein the attachment assembly includes a heat source for rapidly curing a selected adhesive bonding agent. The adhesive attachment assembly includes a first attachment component defining a base surface for receiving the curable bonding agent thereon, and a second attachment component adapted for temporary connection to the substrate. Upon pressed mounting of the first attachment component with bonding agent thereon onto the substrate, the second attachment component is movable into temporary engagement with the substrate, and a spring member reacts between the first and second attachment components to apply a positive force urging the first attachment component toward the substrate for the duration of the bonding agent cure time. A heat source is carried by the first attachment component for activating and/or rapidly curing the bonding agent.
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