| 摘要 |
<p>Multi-layers having at least one plated and filled via or through hole (20) in which a portion of the material (22) filling the via or through hole (20) is removed to allow the spaced previously occupied by the removed material to be used for some other purpose. In some multi-layers, the removed material will be replaced by a second plated via or through hole thus providing additional interconnect options or to functioning as a part of a larger component.</p> |
