发明名称 |
Copper polishing cleaning solution |
摘要 |
A cleaning solution for removing copper complex residues from the surface of polishing pads and wafer substrates includes an amine pH-adjusting agent, which can be a unidentate or bidentate amine compound or a quartnary ammonium hydroxide compound or an amine including an alcohol group. The cleaning solution also includes an amino acid complexing agent and an inhibitor. In a preferred embodiment, the cleaning solution has a basic pH.
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申请公布号 |
US2003119692(A1) |
申请公布日期 |
2003.06.26 |
申请号 |
US20020050422 |
申请日期 |
2002.01.16 |
申请人 |
SO JOSEPH K.;THOMAS TERENCE M. |
发明人 |
SO JOSEPH K.;THOMAS TERENCE M. |
分类号 |
B08B3/08;B24B53/007;C11D3/30;C11D3/33;C11D7/32;C11D11/00;H01L21/02;H01L21/304;H01L21/321;(IPC1-7):C11D1/00 |
主分类号 |
B08B3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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