| 摘要 |
A scanning projection exposure apparatus includes a mask stage (RST) which moves with a mask (R) being placed thereon, a wafer stage (WST) which moves with a wafer (W) being placed thereon, a reference plate (22) fixed to the mask stage (RST) and having a mark, and a detection system (23) capable of optically detecting the mark. The position of the mark on the reference plate (22) is detected by the detection system (23). The mask stage (RST) is further moved in the scanning exposure direction. A mark on the mask (R) is detected by the detection system (23) with reference to the position of the mark on the reference plate (22). A deformation amount of the mask (R) is obtained. The mask stage (RST) and wafer stage (WST) are scanned in synchronism with each other with respect to a projection optical system (8). A pattern on the mask (R) is projected onto the wafer (W) through the projection optical system (8).
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