发明名称 Release material, release material article, and process for producing the release material article
摘要 The present invention provides a release material formed by irradiating a release material precursor having a shear storage modulus of about 1x102 to about 3x106 Pa at 20° C. and a frequency of 1 Hz, wherein the release material has a contact angle of 15° or more, measured using a mixed solution of methanol and water (volume ratio: 90/10) having a wet tension of 25.4 mN/m. The release material of the present invention has improved anchoring to certain substrates, ensuring relatively low release strength from certain pressure-sensitive adhesives, particularly even after the exposure to a high temperature. Thus, the release materials are capable of allowing the pressure-sensitive adhesive to maintain stable residual adhesion strength.
申请公布号 US2003118770(A1) 申请公布日期 2003.06.26
申请号 US20020203826 申请日期 2002.08.13
申请人 SUWA TOSHIHIRO;SHINOHARA MASARU;YASUI YUTAKA;TOMA TETSUYA 发明人 SUWA TOSHIHIRO;SHINOHARA MASARU;YASUI YUTAKA;TOMA TETSUYA
分类号 C09J7/02;(IPC1-7):B32B33/00 主分类号 C09J7/02
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