| 摘要 |
The method is for manufacturing and using an electronic device chassis, comprising; the casing (10A) is provided by a bottom panel (12), and top panel (14) and side panels (16, 18). A foam plastic member (40) is adhered to the side panel (16) and a foam plastic member (43) is attached to a central panel (26). The member (40) has a first cavity (500) defined therein and the member (43) has a first cavity (504) defined therein. The first cavity (500) faces the first cavity (504) to form a top shelf (510). The front panel (114) of a shuttle (10B) is folded along a folding segment (105) to expose the members (40, 43) of the casing (10A). The shuttle (10B) including a main board (73) is pulled out below the members (40, 43). An electronic component (508) is pulled out from the top shelf (510) and the front panel (114) is attached to the casing (10A).
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