发明名称 |
Electroless plating system |
摘要 |
A method and apparatus for plating substrates, wherein the apparatus includes a central substrate transfer enclosure having at least one substrate transfer robot positioned therein. A substrate activation chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate plating chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. A substrate spin rinse dry chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot, and an annealing chamber in communication with the central substrate transfer enclosure is provided and is accessible to the at least one substrate transfer robot. At least one substrate pod loader in communication with the substrate transfer chamber and accessible to the at least one substrate transfer robot is also provided.
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申请公布号 |
US2003118732(A1) |
申请公布日期 |
2003.06.26 |
申请号 |
US20010036321 |
申请日期 |
2001.12.26 |
申请人 |
STEVENS JOSEPH J.;LUBOMIRSKY DMITRY;PANCHAM IAN;OLGADO DONALD J.;GRUNES HOWARD E.;MOK YEUK-FAI EDWIN;DIXIT GIRISH |
发明人 |
STEVENS JOSEPH J.;LUBOMIRSKY DMITRY;PANCHAM IAN;OLGADO DONALD J.;GRUNES HOWARD E.;MOK YEUK-FAI EDWIN;DIXIT GIRISH |
分类号 |
C23C18/16;H01L21/00;(IPC1-7):B05D3/12 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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