发明名称 PREPREG PRODUCTION METHOD AND PREPREG PRODUCTION DEVICE AND PREPREG OBTAINED BY THE PRODUCTION METHOD AND PRODUCTION METHOD FOR INSULATING LAYER ATTACHED COPPER FOIL AND INSULATING LAYER ATTACHED COPPER FOIL OBTAINED BY THE PRODUCTION METHOD
摘要 <p>Production methods capable constantly producing prepreg using a thin skeleton material for ensuring a good laser boring performance, and a thin insulating layer-attached copper foil. A prepreg production method for producing a printed wiring board formed by impregnating a skeleton member with a thermosetting resin, comprising (1) the liquid resin coating forming step of forming a liquid resin layer on a work plane by using a liquid thermosetting resin, (2) the pre-drying step of turning the liquid resin layer into a dry resin layer, (3) the skeleton material pre-bonding step of press-bonding by heating a skeleton member to the dry resin layer to form a skeleton material-attached dry resin layer, (4) the resin impregnating step of heating the skeleton material-attached dry resin layer at a resin-reflowing temperature to impregnate the skeleton material with a resin component, and (5) the cooling step of immediately starting a temperature lowering operation after resin impregnating and maintaining the semi-cured state of the skeleton material-impregnated thermosetting resin for turning into a prepreg state; and a production method for an insulating layer-attached copper foil using similar techniques.</p>
申请公布号 WO2003051964(P1) 申请公布日期 2003.06.26
申请号 JP2002013004 申请日期 2002.12.12
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