| 摘要 |
<p>Herein are disclosed a curable resin composition for coating of flexible circuits comprising a hydrogenated polybutadiene polyol with a number-average molecular weight of 1,000 - 8,000 and having 2 - 10 hydroxyl groups per molecule (Polyol A), and a polybutadiene polyblock isocyanate (Isocyanate X) as coating agent providing flexible coated films with a lower curling tendency.</p> |
