发明名称 |
Method of making an interposer sub-assembly in a printed wiring board |
摘要 |
The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.
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申请公布号 |
US2003116351(A1) |
申请公布日期 |
2003.06.26 |
申请号 |
US20030361659 |
申请日期 |
2003.02.10 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BRODSKY WILLIAM LOUIS;CHAN BENSON;GAYNES MICHAEL ANTHONY;MARKOVICH VOYA RISTA |
分类号 |
H05K3/32;(IPC1-7):H05K1/11 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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