| 摘要 |
<p>invention concerns a method for mounting a microcircuit module in a card body to make the card non-detachable without damage. The method consists in fixing the module (22) in a cavity (12) of the card body (11) with a resin after adjusting the adherence of the resin (30) on the wall of the cavity (12) so that it is markedly higher than its adherence on the module (22).</p> |
