MULTI-LAYERES WITH VIAS IN FILLED HOLES

摘要

Multi-layers having at least one plated and filled via or through hole 20 in which a portion of the material 22 filling the via or through hole 20 is removed to allow the spaced previously occupied by the removed material to be used for some other purpose. In some multi-layers, the removed material will be replaced by a second plated via or through hole thus providing additional interconnect options or to functioning as a part of a larger component.