| 发明名称 |
ELECTROLYTIC PLATING METHOD |
| 摘要 |
PURPOSE: To provide an electrolytic plating method particularly suitable for filling a via. CONSTITUTION: The electrolytic metal plating method is characterized by applying a current with periods consisting of a regular electrolysis time of 1-50 msec, a reverse electrolysis time of 0.2-5 msec, and a downtime of 0.1-20 msec. |
| 申请公布号 |
KR20030051325(A) |
申请公布日期 |
2003.06.25 |
| 申请号 |
KR20020080099 |
申请日期 |
2002.12.16 |
| 申请人 |
SHIPLEY COMPANY, L.L.C |
发明人 |
KUSAKA MASARU;TSUCHIDA HIDEKI |
| 分类号 |
C25D3/38;C25D5/00;C25D5/18;C25D7/00;C25D7/12;H01L21/288;H05K3/42;(IPC1-7):C25D5/00 |
主分类号 |
C25D3/38 |
| 代理机构 |
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