| 摘要 |
PURPOSE: A wafer aligning apparatus for grinding and an aligning method using the same are provided to be capable of preventing the breakage of a wafer, the generation of contaminants due to corrosion, the waste of deionized water, and water from flowing into a device formed at a wafer by using the air exhausted from a plurality of air exhausts formed in a table. CONSTITUTION: A wafer aligning apparatus for grinding is provided with a body part(100) including an air supply line(102) for supplying air, a circular table(104) having a plurality of air exhausts(110) installed on the upper portion of the body part, and a guide(106) capable of moving toward the center portion of the table installed at the edge portion of the table. Preferably, the wafer aligning apparatus further includes a circular trench having the air exhausts.
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