发明名称 POLYMER POLISHING PAD CONTAINING POLISHING PARTICLE
摘要 PURPOSE: A polymer polishing pad containing a polishing particle is provided to reduce the use of polishing slurry and not to use the polishing slurry by containing the polishing particle inside. CONSTITUTION: A polymer polishing pad is composed of polymer agglomeraters(30), and polymeric matrix(22) throughout which the polymer agglomerater is uniformly dispersed. The polymer agglomerater is composed of polymeric microelements(24), polishing particles(26), and water-soluble polymer(28) coupling the polymeric microelement with the polishing particle.
申请公布号 KR20030049768(A) 申请公布日期 2003.06.25
申请号 KR20010080080 申请日期 2001.12.17
申请人 CHOI, CHANG HO;LEE, SUN HEE 发明人 CHOI, CHANG HO;LEE, SUN HEE
分类号 B24D11/00;(IPC1-7):B24D11/00 主分类号 B24D11/00
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