发明名称 |
POLYMER POLISHING PAD CONTAINING POLISHING PARTICLE |
摘要 |
PURPOSE: A polymer polishing pad containing a polishing particle is provided to reduce the use of polishing slurry and not to use the polishing slurry by containing the polishing particle inside. CONSTITUTION: A polymer polishing pad is composed of polymer agglomeraters(30), and polymeric matrix(22) throughout which the polymer agglomerater is uniformly dispersed. The polymer agglomerater is composed of polymeric microelements(24), polishing particles(26), and water-soluble polymer(28) coupling the polymeric microelement with the polishing particle.
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申请公布号 |
KR20030049768(A) |
申请公布日期 |
2003.06.25 |
申请号 |
KR20010080080 |
申请日期 |
2001.12.17 |
申请人 |
CHOI, CHANG HO;LEE, SUN HEE |
发明人 |
CHOI, CHANG HO;LEE, SUN HEE |
分类号 |
B24D11/00;(IPC1-7):B24D11/00 |
主分类号 |
B24D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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