METHOD FOR FORMING CAVITY AT HEAT SPREADER FOR TBGA SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A method for forming a cavity at a heat spreader for a TBGA semiconductor package is provided to be capable of preventing the associated deformation of the heat spreader and improving productivity and reliability by pressing the heat spreader. CONSTITUTION: A heat spreader for a TBGA semiconductor package is prepared(S110). The heat spreader is located on a stamping die, wherein the stamping die having a plurality of recess parts(S120). A plurality of cavities are formed on the upper portion of the heat spreader by stamping using a punch(S130). A plurality of protrusions formed on the lower portion of the heat spreader are cut, wherein the protrusions are associated from the cavity forming process(S140). A polishing process is carried out on the lower portion of the heat spreader(S150). Preferably, the heat spreader is pressed by using a die having a plurality of protrusions corresponding to the cavities(S160).