Bonding head for a wire bonding machine

摘要

A bonding head is provided for a wire bonding machine which comprises a wedge (2) connected to a transducer (3) for applying pressure and ultrasonic energy to a wire guided into contact with a surface to which a wire bond is to be formed. The transducer (3) is biased by a spring mounted at one end to a linear motor (8) for adjustment of the urging force of the spring (10). The actual force applied to the wire is measured by detecting means (6). Control means are provided which are connected to the linear motor for adjusting the urging force of the spring, to thereby obtain a desired pressure to be applied to the wire.