APPARATUS FOR ALIGNING FLAT ZONE OF WAFER

摘要

PURPOSE: An apparatus for aligning flat zone of a wafer is provided to be capable of minimizing the contamination of a roller by using a vacuum supply part and a gas supply part. CONSTITUTION: An air path(100a) is formed in a rotating shaft(100) along the shaft direction. A vacuum supply part(102) is connected with the air path for supplying vacuum pressure to the air path. A roller(106) is installed and continuously attached on the outer surface of the rotating shaft for aligning the flat zone of wafers by the rotation of the rotating shaft, wherein the roller includes a slit(108) connected through the air path. Preferably, the slit is spirally formed on the entire surface of the roller. Preferably, a gas supply part(104) is installed and connected with the air path for selectively supplying compressed gas to the air path.