发明名称 |
SEMICONDUCTOR WAFER GUIDE AND SEMICONDUCTOR WET CLEANING APPARATUS HAVING THE SAME |
摘要 |
PURPOSE: A semiconductor wafer guide and a semiconductor wet cleaning apparatus having the same are provided to be capable of preventing a thin film from remaining on a wafer by roundly or obliquely forming the inner portion of a center fixing groove of the wafer guide. CONSTITUTION: A semiconductor wafer guide(4) is provided with a pair of side support parts(30a,30b) having side fixing grooves(31a,31b) spaced apart from each other, a center support part(32) having center fixing grooves(33) located between the side support parts, and a pair of fixing panel(34a,34b) located at both sides of the side and center support parts. Preferably, the inner portion of the center fixing groove is roundly and obliquely formed for minimizing the contact between the center fixing groove and a wafer.
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申请公布号 |
KR20030048682(A) |
申请公布日期 |
2003.06.25 |
申请号 |
KR20010078657 |
申请日期 |
2001.12.12 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HWANG, IN SEOK;JUN, YONG MYEONG;KO, YONG SEON;LEE, WON JUN;MUN, BONG HO |
分类号 |
H01L21/306;B08B3/04;H01L21/00;H01L21/304;H01L21/673;(IPC1-7):H01L21/304 |
主分类号 |
H01L21/306 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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