SPUTTERING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A sputtering equipment for manufacturing a semiconductor device is provided to be capable of drawing enough power and stably conserving the inner pressure of a chamber regardless of gas volume by installing a baffle on the inner wall of the chamber near to a vacuum pump. CONSTITUTION: A target(400) is installed in a chamber for depositing a thin film on a wafer(200). A vacuum pump(800) is connected with the chamber for conserving the vacuum state of the chamber. A baffle(900) is installed on the inner wall of the chamber. At this time, a connection path between the chamber and the vacuum pump(800) is partially covered with the baffle(900). Preferably, the baffle(900) has a plurality of through holes.