| 摘要 |
PURPOSE: A device for cooling a semiconductor chip is provided to show a high heat release performance in a narrow installation space by applying to a notebook computer. CONSTITUTION: The device includes a cooling fan(25), a casing(20) accepting the cooling fan(25) and forming a cooling fin(21) of a peculiar shape inside, and a heat pipe(30) effectively discharging the heat of the semiconductor chip to the outside by installing to one side of the casing(20). An eddy generator(22) formed in the space between respective cooling fins(21) improves the cooling performance of the cooling fin(21) by the enforced flow flowing in from the cooling fan(25).
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