| 摘要 |
PURPOSE: A device heating and cooling apparatus of a semiconductor device test handler is provided to be capable of accurately controlling semiconductor devices to an aiming temperature state by using a simple structure. CONSTITUTION: A device heating and cooling apparatus is provided with a heat conductive loading plate(3) having a plurality of loading parts for loading wafers, a heating plate(2) installed on the lower portion of the loading plate for heating the loading plate, a cooling plate(1) installed on the lower portion of the heating plate for cooling the loading plate, a heating control part made of heater controller(7,8) and temperature sensing sensors(7a,8a) for controlling the heating temperature of the loading plate by controlling the heat emitted from heaters of the heating plate, and a cooling control part made of a solenoid valve(5), a valve controller(6) and a temperature sensing sensor(6a) for controlling the cooling temperature of the loading plate by controlling the volume of cooling fluid supplied to the cooling plate.
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