发明名称 |
METHOD FOR MANUFACTURING PACKAGE-TYPE BATTERY |
摘要 |
PURPOSE: Provided is a method for manufacturing package-type battery which does not need soldering and can manufacture a package-type of a simple structure in a semi-automatic or full-automatic manner. CONSTITUTION: The method includes the first step of attaching contact terminals to the outer surface of a mold-packaged over-charging/over-current preventing circuit to contact a device driving terminal and a charging terminal of a cathode, and a device driving terminal and a charging terminal of an anode which are disposed in the over-charging/over-current preventing circuit, and the second step of attaching the mold-packaged over-charging/over-current preventing circuit to a surface of a battery cell(400) to contact the terminal(5) corresponding to the device driving terminal of the cathode to a cathode of the battery cell and the terminal corresponding to the device driving terminal of the anode to an anode of the battery cell.
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申请公布号 |
KR20030051023(A) |
申请公布日期 |
2003.06.25 |
申请号 |
KR20010081921 |
申请日期 |
2001.12.20 |
申请人 |
TELSON ELECTRONICS CO., LTD. |
发明人 |
KANG, U SEON |
分类号 |
H01M2/00;(IPC1-7):H01M2/00 |
主分类号 |
H01M2/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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