发明名称 |
METHOD OF SECURING SOLDER BALLS AND ANY COMPONENTS FIXED TO ONE AND THE SAME SIDE OF A SUBSTRATE |
摘要 |
To transfer mold a transfer molding compound on a substrate having discrete components (2) and solder balls (3) on one and the same side, the discrete components (2) having a height that is less than the diameter of the solder balls (3), the substrate is placed on one part (6) of an transfer molding tool with the components (2) and the solder balls (3) facing the other part (7). When the parts (6, 7) of the transfer molding tool are pressed together, that other part (7) is adapted to receive the components (2) and the solder balls (3) and comprises flat-bottomed cavities (8) for individually receiving a top portion of each solder ball (3) and for flattening the top portion of each solder ball (3). |
申请公布号 |
EP1320881(A1) |
申请公布日期 |
2003.06.25 |
申请号 |
EP20010958750 |
申请日期 |
2001.08.07 |
申请人 |
TELEFONAKTIEBOLAGET L M ERICSSON (PUBL) |
发明人 |
OLOFSSON, LARS-ANDERS;JONAS, IVAN |
分类号 |
H01L21/56;H05K3/28;H05K3/34;(IPC1-7):H01L21/60;H01L21/54;H01L23/31;H01L23/48 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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