发明名称
摘要 A structure and method for making a cavity fuse over a gate conductor stack. The method includes providing a semiconductor substrate having a gate conductor stack over a shallow trench isolation region, forming oxide layers on the substrate about the gate conductor stack, etching electrical contact holes through the oxide layers to the substrate, filling the electrical contact holes with a first conductive material to establish electrical contact with the gate conductor stack, etching a pattern in an uppermost oxide layer of the oxide layers, depositing a conductive layer of a second conductive material over the oxide layers and the electrical contacts, planarizing the conductive layer whereby the conductive material remains only in the pattern, anisotropically etching the oxide layers to form at least one etching hole through the oxide layers to the shallow trench isolation region, and isotropically etching at least a portion of the oxide layers about the etching hole, whereby a cavity is formed beneath at least a portion of the conductive layer pattern, the gate conductor stack comprising a fuse. <IMAGE>
申请公布号 KR100388399(B1) 申请公布日期 2003.06.25
申请号 KR20000015746 申请日期 2000.03.28
申请人 发明人
分类号 H01L21/82;H01H69/02;H01H85/00;H01L21/8242;H01L23/525;H01L27/108 主分类号 H01L21/82
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