MULTILAYERED VERTICAL SINGLE WAFER-TYPE APPARATUS FOR PROCESSING WAFER

摘要

PURPOSE: A multilayered vertical single wafer-type apparatus for processing a wafer is provided to remarkably reduce an area occupied by a semiconductor processing apparatus by vertically installing multi process chambers. CONSTITUTION: A wafer cassette(30) is loaded to at least one load port(35). The first transfer module is installed in the rear part of the load port, capable of moving vertically and horizontally. Multi transfer chambers(60) include the second transfer module operating together with the first transfer module, vertically installed in the rear part of the first transfer module. A plurality of process chambers(70) are so connected that the second transfer module can be loaded/unloaded to/from the process chambers, corresponding to each transfer chamber. A single wafer-type semiconductor wafer processing apparatus is so connected that the second transfer module can be loaded/unloaded to/from the single wafer-type semiconductor wafer processing apparatus, corresponding to each transfer chamber. The single wafer-type semiconductor wafer processing apparatus includes a cooling/standby chamber(80) for making the wafer wait in the process chamber or cools a completed wafer.