Method and structure for joining two substrates with a low melt solder joint

摘要

A method and structure to electrically and mechanically join a first a first electrically conductive pad on a first substrate to a second electrically conductive pad on a second substrate using a solder joint that includes a low-melt solder alloy composition. The second electrically conductive pad has a geometry that compels a gap size of a gap between the first substrate and the second substrate to exceed a distance between the first substrate and a surface of the second pad.