发明名称 COATING AND BINDER TO SUPPRESS RELEASE OF FORMALDEHYDE FROM FORMALDEHYDE-BASED RESIN
摘要 <p><P>PROBLEM TO BE SOLVED: To obtain a coating material and a board binder composed of a formaldehyde resin and having low releasing rate of formaldehyde. <P>SOLUTION: The coating material composition having low releasing rate of formaldehyde contains the formaldehyde resin and a polyamide scavenger. In an embodiment, the polyamide is a synthetic polyamide and, in another embodiment, the synthetic polyamide is selected from the group essentially consisting of a polyacrylamide, a polymethacrylamide, a polyamide telomer, an N-substituted polyamide and their combinations. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003176446(A) 申请公布日期 2003.06.24
申请号 JP20020258177 申请日期 2002.09.03
申请人 ARMSTRONG WORLD INDUSTRIES INC 发明人 BELMARES HECTOR;CALDWELL KENNETH G
分类号 B32B27/42;C08L61/06;C08L61/24;C08L61/28;C09D7/12;C09D133/26;C09D161/00;C09D161/06;C09D161/24;C09D161/28;C09D177/00;C09D189/00;C09J161/28;(IPC1-7):C09D161/00 主分类号 B32B27/42
代理机构 代理人
主权项
地址
您可能感兴趣的专利